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Copper Slug

Description:

Copper particle is an excellent evaporation material in vacuum coating industry. It has the same properties as the metal copper, which is a red-orange metal with a melting point of 1083°C, a density of 8.96g/cm3, and a boiling point of 2567°C. Due to the excellent properties of high purity copper materials, copper targets have been widely used in electronic, communication, superconductivity, aerospace and other frontier fields.
Technical Parameter

  Material Name

  Copper

  Molecular Formula

  Cu

  CAS.No

  7440-50-8

  Molecular Weight

  63.545

  Density

  8.92 g/cm3

  Fusing Point

  1083.4 ℃

  Boiling Point

  2580 ℃

  Flash Point

  -23 ℃

  Solubility (water)

  Insoluble in water, soluble in alkali, hydrochloric acid, sulfuric acid

Product Application
Applications in scientific experimental research, nano-processing, device manufacturing and other related products, widely used in flat display, semiconductor, solar cells, optical components, energy-saving glass and other fields.
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