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Silica Target

Description:

Silicon dioxide (SiO2) sputtering targets can be used for semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) displays and optical applications.
Technical Parameter

  Material Name

  Silicon Dioxide

  Molecular Formula

  SiO2

  CAS.No

  60676-86-0

  Molecular Weight

  60.084

  Density

  2.6 g/mL at 25℃(lit.)

  Fusing Point

  2230℃

  Boiling Point

  1610℃

Product Application

Microelectronics and Optoelectronics

Insulating layer: In microelectronic equipment, silica film as an insulating layer, can effectively isolate the conductive part of the electronic device, prevent current leakage, and ensure the normal operation of the equipment.

Anti-reflective layer: In optoelectronic devices such as LED, optical lenses and solar cells, silica films are used as anti-reflective layers to reduce the reflection loss of light and improve the transmittance of light or photoelectric conversion efficiency.

Optical waveguide: Silicon dioxide thin films are used as optical waveguide materials in optical fiber communication and integrated optical circuits for transmitting and processing optical signals because of their excellent optical transparency and stability.


Photovoltaic Field

Surface passivation layer: The application of silica thin films on solar cells can reduce the recombination of surface carriers and improve the efficiency of the battery. In addition, as an anti-reflective layer, it can also increase the absorption of light, further improving the performance of the battery.


Surface Protection Field

Anti-corrosion and protective coating: The application of silicon dioxide film on the metal surface can effectively prevent corrosion and wear, and extend the service life of the material. In the protection of cultural heritage, silica films are also used to protect the surfaces of substances that are vulnerable to environmental impacts.