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Copper Target

Description:

Copper target material is an excellent sputtering material in vacuum coating industry. It has the same properties as the metal copper, which is a red-orange metal with a melting point of 1083°C, a density of 8.96g/cm3, and a boiling point of 2567°C. Due to the excellent properties of high purity copper materials, copper targets have been widely used in electronic, communication, superconductivity, aerospace and other frontier fields.
Technical Parameter

Element Introduction

Elemental Property

  Chinese Name

  Copper

  Coefficient of Expansion

（25℃）16.5μm·m-1·K-1

  Molecular Formula

  Cu

  Thermal Conductivity

  401W·m-1·K-1

  CAS.No

  7440-50-8

  Electrical Resistivity

（20℃）1.678x10-8uΩ·m

  State of Matter

  Solidity

  Young's Modulus

  110-128 GPa

  Density

  8.96·cm³

  Shear Modulus

  48 GPa

  Boiling Point

  1084.62℃

  Bulk Modulus

  140 GPa

  Fusing Point

  2562℃

  Mohs Hardness

  3.0

  Heat of Fusion

  13.26 kJ·mol-1

  Brinell Hardness

  235-878Mpa

  Heat of Vaporization

  300.04 kJ·mol-1

  Magnetic Sequence

  Diamagnetism

  Specific Heat Capacity

  24.86 J·mol-1·K-1

  Crystal Structure

  Face-centered cube

Product Application
Applications: Scientific experimental research applications, nano-processing, device manufacturing and other related products, widely used in flat display, semiconductor, solar cells, optical components, energy-saving glass and other fields.
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